Produk
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High-Precision Single-Sisi Polishing Equipment
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Mesin Penggiling Presisi Sisi kaping pindho kanggo wafer SiC Sapphire Si
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Multi-Wire Diamond Sawing Machine kanggo SiC Sapphire Ultra-Hard Brittle Materials
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SICOI (Silicon Carbide ing Insulator) Wafer SiC Film ON Silicon
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Diamond Wire Cutting Machine kanggo SiC | sapir | Kuarsa | kaca
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Mesin Polishing Robot - Rampung Permukaan Otomatis Presisi Tinggi
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Ion Beam Polishing Machine kanggo sapir SiC Si
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JGS1, JGS2, lan JGS3 Kaca Optik Silika Fused
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BF33 Wafer Kaca Substrat Borosilikat Lanjut 2″4″6″8″12″
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Wafer Kuarsa Fused Kemurnian Tinggi kanggo Semikonduktor, Aplikasi Optik Fotonik 2″4″6″8″12″
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Sapphire Wafer Blank High Purity Raw Sapphire Substrat kanggo Processing
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Kothak Wafer Luwes - Siji Solusi kanggo Akeh Ukuran Wafer