Substrat SiC 4H-N wafer kelas produksi SiC 8 inci
Tabel ing ngisor iki nuduhake spesifikasi wafer SiC 8 inci kita:
| Spesifikasi DSP SiC tipe-N 8 inci | |||||
| Nomer | Barang | Unit | Produksi | Riset | Bodho |
| 1:parameter | |||||
| 1.1 | politipe | -- | 4H | 4H | 4H |
| 1.2 | orientasi permukaan | ° | <11-20>4±0.5 | <11-20>4±0.5 | <11-20>4±0.5 |
| 2: Parameter listrik | |||||
| 2.1 | dopan | -- | Nitrogen tipe-n | Nitrogen tipe-n | Nitrogen tipe-n |
| 2.2 | resistivitas | ohm ·cm | 0.015~0.025 | 0.01~0.03 | NA |
| 3: Parameter mekanik | |||||
| 3.1 | diameter | mm | 200±0.2 | 200±0.2 | 200±0.2 |
| 3.2 | kekandelan | μm | 500±25 | 500±25 | 500±25 |
| 3.3 | Orientasi takik | ° | [1- 100]±5 | [1- 100]±5 | [1- 100]±5 |
| 3.4 | Ambane Takik | mm | 1~1.5 | 1~1.5 | 1~1.5 |
| 3.5 | LTV | μm | ≤5 (10mm * 10mm) | ≤5 (10mm * 10mm) | ≤10 (10mm * 10mm) |
| 3.6 | TTV | μm | ≤10 | ≤10 | ≤15 |
| 3.7 | Gandhewa | μm | -25~25 | -45~45 | -65~65 |
| 3.8 | Warp | μm | ≤30 | ≤50 | ≤70 |
| 3.9 | AFM | nm | Ra≤0.2 | Ra≤0.2 | Ra≤0.2 |
| 4: Struktur | |||||
| 4.1 | kapadhetan mikropipa | saben/cm2 | ≤2 | ≤10 | ≤50 |
| 4.2 | kandungan logam | atom/cm2 | ≤1E11 | ≤1E11 | NA |
| 4.3 | TSD | saben/cm2 | ≤500 | ≤1000 | NA |
| 4.4 | BPD | saben/cm2 | ≤2000 | ≤5000 | NA |
| 4.5 | TED | saben/cm2 | ≤7000 | ≤10000 | NA |
| 5. Kualitas ngarep | |||||
| 5.1 | ngarep | -- | Si | Si | Si |
| 5.2 | lapisan permukaan | -- | CMP Si-face | CMP Si-face | CMP Si-face |
| 5.3 | partikel | wafer | ≤100 (ukuran ≥0.3μm) | NA | NA |
| 5.4 | ngeruk | wafer | ≤5, Dawane Total ≤200mm | NA | NA |
| 5.5 | Pinggir keripik/lekukan/retak/noda/kontaminasi | -- | Ora ana | Ora ana | NA |
| 5.6 | Wilayah politipe | -- | Ora ana | Jembar ≤10% | Jembar ≤30% |
| 5.7 | tandha ngarep | -- | Ora ana | Ora ana | Ora ana |
| 6: Kualitas mburi | |||||
| 6.1 | finish mburi | -- | MP rai-C | MP rai-C | MP rai-C |
| 6.2 | ngeruk | mm | NA | NA | NA |
| 6.3 | Cacat pinggir mburi chip/indentasi | -- | Ora ana | Ora ana | NA |
| 6.4 | Kasar punggung | nm | Ra≤5 | Ra≤5 | Ra≤5 |
| 6.5 | Tandha mburi | -- | Takik | Takik | Takik |
| 7: pinggiran | |||||
| 7.1 | pinggiran | -- | Talang | Talang | Talang |
| 8: Paket | |||||
| 8.1 | kemasan | -- | Siap-epi nganggo vakum kemasan | Siap-epi nganggo vakum kemasan | Siap-epi nganggo vakum kemasan |
| 8.2 | kemasan | -- | Wafer multi-wafer kemasan kaset | Wafer multi-wafer kemasan kaset | Wafer multi-wafer kemasan kaset |
Diagram Rinci
Produk sing gegandhengan
Tulis pesenmu ing kene lan kirim menyang kita